Search Results for "FintechOS"
10 results for "FintechOS"
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FintechOS Launches Evolv AI-Driven Platform for Banks and Insurers
FintechOS launched Evolv, an AI-driven platform update designed to help banks and insurers accelerate digital transformation. The platform features AI automation, personalized customer experiences, and secure AI interactions. It aims to enable financial institutions to modernize their product offerings and customer engagement.
FintechOS Secures $60M Series B+ for Global Financial Platform Expansion
FintechOS, a financial product management and digital infrastructure platform, raised $60 million in a Series B+ round led by Molten Ventures, Cipio Partners, and BlackRock. The funding will support global expansion and core banking systems modernization, reinforcing the platform's role in enabling embedded finance capabilities for banks and insurers.
FintechOS Launches Version 24 Platform for Banks and Embedded Finance
FintechOS released its version 24 platform update designed to help banks and insurers manage financial products, enable ecosystem partnerships, and pursue embedded finance models. The update features open APIs and integrations that facilitate BaaS and embedded offerings. It positions FintechOS as an enablement layer for traditional financial institutions seeking fintech partnerships.
PwC and FintechOS Collaborate on Embedded Banking Solutions
PwC and FintechOS announced a collaboration to support PwC's Infinite Financial Solutions for Banking. FintechOS serves as the integration layer for low-code product configuration, Open Banking, and payments, accelerating digital transformation for banking clients.
FintechOS and Salt Edge Partner for Hyper-Personalized Open Banking
FintechOS and Salt Edge announced a partnership on April 5, 2022, combining FintechOS's financial infrastructure platform with Salt Edge's open banking APIs. The partnership aims to deliver PSD2-compliant, hyper-personalized banking experiences for financial institutions across Europe.
Dana and FintechOS Partner for Embedded Lending in South Asian Markets
Dana and FintechOS announced a partnership on March 30, 2022, to enable banks and platforms in South Asia to deliver digital banking and embedded lending. The collaboration leverages AI-powered APIs and lending engines to streamline financial product delivery. The deal positions both companies to capture the growing embedded finance opportunity in emerging markets.
FintechOS Launches Version 22 Platform with Embedded Finance Capabilities
FintechOS released version 22 of its low-code platform for banks and insurers, featuring pre-built APIs, embedded video, and a digital banking app supporting embedded finance use cases. The platform aims to accelerate digital transformation for financial institutions.
FintechOS Launches in US to Drive Digitalization for Banks and Credit Unions
FintechOS expanded into the US market with its low-code platform targeting banks, credit unions, and fintechs. The company aimed to help underserved financial institutions digitize and launch digital products rapidly. FintechOS planned to support over 15 US institutions with its embedded finance and digital banking tools.
FintechOS Raises $60M Series B for Low-Code Banking Platform
FintechOS raised $60 million in Series B funding to scale its low-code platform that enables banks and insurers to rapidly build and deploy digital financial products. The platform supports embedded finance use cases by allowing financial institutions to modernize and digitize their product offerings. This funding round highlights growing investor interest in infrastructure enabling embedded financial services.
First Bank Partners with FintechOS to Launch Digital Mortgage Channel
First Bank initiated a partnership with FintechOS in May 2020 to build an end-to-end digital self-service mortgage channel. The platform cut Time To Yes by 89% and achieved a 25% conversion rate. The collaboration exemplifies embedded finance trends where banks integrate fintech platforms for rapid digital lending without heavy internal investment.