Highnote Raises $90M Series B for Embedded Payments Platform

Highnote raised $90 million in a Series B funding round in January 2025, making it one of the top fintech raises of the month. The company provides embedded payments infrastructure, including card issuing and payment processing capabilities, that enables businesses to integrate financial services into their platforms. The substantial round reflects strong investor interest in embedded payments infrastructure as a key enabler of Banking-as-a-Service and embedded finance strategies.

Highnote's platform serves as critical middleware connecting banks, brands, and consumers in the embedded finance value chain. The funding will support further development and scaling of its payments platform. The round was among the largest fintech raises globally in January 2025, underscoring the competitive dynamics and capital intensity of the embedded payments infrastructure market.